Chemical vapor deposition (CVD) is a chemical process for depositing thin films of various materials. In a typical CVD process the substrate is exposed to one or more chemical vapor deposition ticn volatile precursors, which react and/or decompose on the chemical vapor deposition cvd substrate surface to produce the desired deposit. Frequently, volatile byproducts are also produced, which are removed by gas flow through the reaction chamber.
CVD is widely used in the semiconductor industry, as part of the semiconductor device fabrication process, to deposit various films steps in chemical vapor deposition including: polycrystalline, amorphous, and epitaxial silicon, SiO2, silicon germanium, tungsten, silicon nitride, silicon oxynitride, titanium nitride, and various high-k dielectrics. The CVD process is also used to produce synthetic diamonds.
A number of forms of CVD are in wide use and are frequently referenced in the literature.
- Atmospheric pressure CVD (APCVD) - CVD processes at atmospheric pressure.
- Atomic layer CVD (ALCVD) - A CVD process in which two complementary precursors (eg. Al(CH3)3 how does chemical vapor deposition work and H2O) are alternatively introduced into the reaction chamber. Typically, one of the precursors will adsorb onto the substrate surface, but cannot completely decompose without the second precursor. The precursor adsorbs until it saturates the surface and further growth cannot occur until the second precursor is introduced. Thus the film thickness is controlled by the number of precursor cycles rather than the deposition time as is the case for conventional CVD processes. In theory ALCVD allows for extremely precise control of film thickness and uniformity.
- Low-pressure CVD (LPCVD) - CVD processes at subatmospheric pressures. Reduced pressures tend to reduce unwanted gas phase reactions and improve film uniformity across the wafer. Most modern CVD process are either LPCVD or UHVCVD.
- Metal-organic CVD (MOCVD) - CVD processes based on metal-organic precursors, such as Tantalum Ethoxide, Ta(OC2H5)5, to create TaO, Tetra Dimethyl amino Titanium (or TDMAT) to create TiN. MOCVD is also called as MOMBE when it is under ultra-high vacuum.
- Microwave plasma-assisted CVD (MPCVD)
- Plasma-enhanced CVD (PECVD) - CVD processes that utilize a plasma to enhance chemical reaction rates of the precursors. PECVD processing allows deposition at lower temperatures, which is often critical in the manufacture chemical vapor deposition equipment of semiconductors. See also Plasma processing.
- Rapid thermal CVD (RTCVD) - CVD processes that use heating lamps or other methods to rapidly heat the wafer substrate. Heating only the substrate rather what is chemical vapor deposition than the gas or chamber walls helps reduce unwanted gas phase chemical vapor deposition process reactions that can lead to article formation.
- Remote plasma-enhanced CVD (RPECVD) - Similar to PECVD except that the wafer substrate is not directly in the plasma discharge region. Removing the wafer from the plasma region allows processing temperatures down to room temperature.
- Ultra-high vacuum CVD (UHVCVD) - CVD processes chemical vapor deposition systems at very low pressures, typically in the chemical vapor deposition range of chemical vapor deposition diamond tools coated a few to a hundred millitorrs.
- Silicon or silicon germanium epitaxy
- Polysilicon deposition
- TEOS deposition
See also
- Plasma
- Physical vapor deposition
Electronics Topics
The field of electronics is the study and use of systems that operate by controlling the flow of electrons or other electrically charged particles in devices such as thermionic valves and semiconductors. The design and construction of electronic circuits to solve practical problems is part of the fields of electronic engineering, and the hardware design side of computer engineering. The study of new semiconductor devices and their technology is sometimes considered as a branch of physics.
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